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Releases: PreFab-Photonics/PreFab

v1.1.5

05 Nov 20:36
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  • Fix alignment issue in Device._device_to_gdstk method, which is used in Device.to_gdstk and Device.to_gds.
  • Minor linting fixes.

v1.1.4

01 Nov 16:20
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  • Added custom vector-Jacobian product (VJP) for the predict.predict_array_with_grad function.
  • Changed some of the docstrings in prefab.predict to be more consistent and clear.

v1.1.3

26 Oct 17:40
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  • Moved prediction logic to prefab.predict module.
  • First version of predict.predict_array_with_grad, which returns both the predicted array and its gradient. This is useful to fabrication-aware inverse design (FAID). More to come.
  • Added origin parameter to GDS-related export methods.
  • Small docstring fixes.

v1.1.2

10 Oct 23:31
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  • User warning if compare.intersection_over_union, compare.hamming_distance, or compare.dice_coefficient are called with non-binarized devices.
  • Added height parameter to many shape constructors in prefab.shapes to give more flexibility.
  • Updates to the README.md to keep current.
  • Device.is_binary is now a property.
  • Moved Device.enforce_feature_size logic to prefab.geometry module.
  • Added required version of gdstk to pyproject.toml.
  • Removed leftover return statement in geometry.rotate.

v1.1.1

24 Sep 17:01
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  • Manually adding small random noise to the semulated images to better match the real data. This is ideally included in the model training, but for now this is a quick fix.
  • Added z-padding to the device array before exporting to STL with Device.to_stl to ensure that the exported device is closed.
  • Removed buffer from Device.device_array before exporting to with Device.to_gdsfactory.

v1.1.0

23 Sep 13:57
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  • The additions from 1.0.3 and 1.0.4 releases, which should be considered part of this release. Release planning a work in progress.
  • Import and export from/to Tidy3D simulations with Device.to_tidy3d and read.from_tidy3d.
  • Import and export from/to gdsfactory components with Device.to_gdsfactory and read.from_gdsfactory.
  • Convert 2D device structures into 3D arrays or STL files with Device.to_3d and Device.to_stl. This is useful for simulating processes with angled sidewalls.
  • Check and visualize the effect of enforcing a minimum feature size on the device geometry with Device.check_feature_size and Device.enforce_feature_size.

v1.0.4

19 Sep 22:16
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  • Option to specify GPU or CPU in predict, correct, and semulate functions. GPU option has more overhead and will take longer for small devices, but will be faster for larger devices.
  • Improve clarity of messaging for authentication errors.

v1.0.3

15 Sep 13:06
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  • Added this CHANGELOG.md file.
  • Added prefab.shapes module to replace the now removed devices directory. This module contains helpful device constructors for testing PreFab models on.
  • Added __version__ class attribute to prefab package.
  • Added ANT_NanoSOI_ANF1-d8 and ANT_NanoSOI_ANF1-d10 models (see prefab.models and docs/models.md).
  • Updated notebook examples to use prefab.shapes module and newest models.
  • Updated dependencies in pyproject.toml.
  • Simplified .gitignore and .gitattributes files.
  • Docstring improvements to prefab.compare module.
  • Ability to specify thickness to all four sides of buffer thickness in prefab.device.BufferSpec.
  • Changed some of the array resizing logic in prefab.read module to be more robust.
  • Minor fixes to prefab.device module.
  • Minor fixes to prefab.geometry module.
  • Removed devices directory from the repository. Effectively replaced with prefab.shapes module.
  • Remove requirements.txt file as pyproject.toml contains all dependencies.

v1.0.2

06 Aug 22:14
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Added preview for new model: generic_DUV-SOI.

v1.0.1

13 May 12:59
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Add missing dependencies.