Heatsink removal guidance suggestions

[ReFil]

Picobooted my gamecube today and very nearly destroyed it by knocking off DA15, DA16 and DA28. The warnings on the wiki are good, I let it warm up, then twisted it but still clipped the components. Luckily the pads were preserved and i was able to solder them back on.

Maybe an image of the board with the components at high risk highlighted should be added? Twisting the heatsink seems very prone to clipping DA15 and any movement in the direction of the ram chips (which can also happen whilst twisting) will hit DA28. I think a better recommendation is moving it laterally towards the side with the power wire, but not too far as you'll hit the ram chips. Just shuffle it back and forth approx 5 mm, maybe with some isopropyl alcohol in there to loosen the pads, or leave the top middle screw in a few turns to preserve DA28 and twist a tiny bit? If anyones got a dead board it might be good to characterise those components so suitable replacements can be suggested from mouser etc. Judging from the connections DA15 and DA16 are only important for SP2 so other loader methods could be used if they're missing

Other than the scare installing it, it's been excellent, absolutely flawless so far :)